On May 13, 2025, INTAMSYS, in collaboration with leading advanced materials company Kingfa, hosted a joint webinar titled "Industrial FFF 3D Printing Solutions Based on PC Materials." The event focused on the advantages of polycarbonate (PC) materials, key FFF printing technologies, real-world industrial applications, and the release of INTAMSYS’s new white paper. Below is a recap of the key highlights from the session:
According to Jimmy Yuan, Product Director at INTAMSYS, polycarbonate (PC) is a widely used engineering thermoplastic with a global annual consumption of approximately 4.6 to 5 million tons. Traditionally shaped via injection molding, extrusion, blow molding, and thermoforming, PC materials are well-suited for standardized mass production. However, the growing demand for customized, lightweight, and small-batch high-performance parts highlights the limitations of conventional methods.
Industrial-grade FFF has emerged as a flexible and adaptive alternative, particularly suited to complex designs and on-demand manufacturing. PC-based FFF parts are now broadly adopted across industries such as electronics, transportation, automotive, general manufacturing, research and education, and print service bureaus, serving roles as functional prototypes, tooling and jigs, and end-use components.
While PC offers excellent mechanical and thermal properties, it presents several technical challenges in FFF 3D printing:
Limited melt flow and thermal processing window
High shrinkage and risk of warping
Low interlayer (Z-axis) strength
Porosity and void formation
Narrow and demanding print temperature range
To address these issues, INTAMSYS offers an integrated, industrial-grade approach:
Material Optimization through Formulation
Development of PC-GF (glass fiber), PC-CF (carbon fiber), and polymer blends (PC-ABS, PC-PBT) improves flowability and dimensional stability.
Thermal Management with High-Temperature Equipment
Use of enclosed chambers with chamber temperatures above 100°C mitigates thermal stress and deformation, ensuring reliability in large-format prints.
Precision Process Control
Tuning of slicing parameters—such as infill density, path overlap, wall thickness, and layer dwell time—enhances interlayer bonding and reduces residual stress.
INTAMSYS offers a comprehensive platform for industrial FFF, encompassing printers, materials, service capabilities, and slicing software:
Printer Portfolio
FUNMAT PRO 310 NEO – Optimized for small to medium PC parts with high performance and cost efficiency
FUNMAT PRO 610HT – Supports ultra-high-performance materials such as PEEK and PEI
Material Ecosystem
A full suite of PC materials, including standard PC, PC-GF, PC-CF, and PC-based blends, optimized for high-temperature printing platforms
INTAMSYS’s PC-based FFF solutions have been deployed by industrial customers worldwide. Jimmy shared several representative cases during the webinar, including:
Schneider Electric
At its smart factory in Plovdiv, Bulgaria, Schneider Electric uses the FUNMAT PRO 310 NEO to produce PC/PA6/PPA parts and jigs in-house, reducing outsourcing dependence and accelerating production cycles.
Other users include ASMPT (semiconductor packaging), Thales Alenia Space, and Joyson Safety Systems, showcasing the versatility and reliability of INTAMSYS solutions across multiple sectors.
During the event, INTAMSYS officially launched its new white paper on industrial FFF 3D printing with PC materials. The document provides:
An overview of PC material properties
Typical industrial applications of FFF with PC
Technical challenges in the printing process and corresponding solutions
INTAMSYS’s systematic approach to high-performance part production
Download the free whitepaper >>
Haowei Cao, Additive Manufacturing Services Manager at INTAMSYS, introduced the company’s advanced 3D printing service capabilities, including a scalable industrial-grade FFF production center:
Materials supported: PEEK family, PEI family, PPSU, PC, ABS, PA, and more
Production scale: Over 100 machines deployed, annual capacity up to 11 tons
Post-processing capabilities: Sanding, sealing, painting, and customized finishes
Smart factory management: Real-time tracking, order traceability, and part inspection system
Applications span aerospace, humanoid robotics, research institutes, and high-tech manufacturing, supporting part quantities ranging from dozens to thousands.
Learn more about INTAMSYS Printing Services >>
Minjian Ma, PC Product Line Technical Manager at Kingfa, shared the company’s latest advancements in PC material innovation, focusing on four key directions:
Flame retardancy: Halogen-free PC/ABS blends stable at 105–120°C
Aesthetics: Targeting consumer electronics appearance needs
Structural reinforcement: Improved dimensional stability for precision components
Functionalization: Applications in photovoltaics, EV battery packs, and smart connectors
This webinar showcased not only the synergy between high-performance materials and industrial 3D printing equipment, but also highlighted the enormous potential of PC materials in FFF-based manufacturing. INTAMSYS will continue working with partners across materials, manufacturing, and services to drive innovation and expand industrial adoption of additive technologies.
Stay connected with INTAMSYS as we continue to push the boundaries of additive manufacturing.